Tokyo, Japan - The new platform of LTE device has announced by Reneses Electronics Corporation (TSE:6723) and its subsidiary, Reneses Mobile Corporation. Feb 8th 2011 anounced its LTE Triple-mode modem platform, The SP 2531, which integrated a single-chip triple-mode baseband processor for supporting 4G LTE, HSPA+(GSM), RF transceiver ICs, High power amplifier, power management device and other related software.
The LTE triple-mode modem platform is targeted at the convergence market which demands high performance, high levels of integration and a power efficient implementation covering such key use cases as browsing and streaming. It also supports TD-LTE and FDD-LTE cat 3 (100Mbps downlink (DL) / 50Mbps uplink (UL)) along with HSPA+ features such as DC-HSDPA cat 24 and HSUPA cat 7 giving 3G data rates of 42Mbps (DL) /11.5Mbps (UL) respectively with global coverage through its unique RF design.
The triple-mode modem platform will be available for sampling in March 2011 as a reference design and comes complete with consulting services to enable rapid time to production. Mass production is expected to be in late 2011. The LTE triple-mode modem platform comes with extensive support for all the major mobile OS’s including AndroidTM, MeeGoTM and SymbianTM as well as LinuxTM and Windows MobileTM on PCs allowing easy integration as an embedded modem, including standalone, or a companion to an applications processor in a high-end smartphones or tablet devices. (Renesasmobile)
