LTE Modem Module by Intel, ST-Ericsson, Qualcomm GOBY, Sequans - MWC 2013

LTE by Intel - well known chip maker for PC and here now announced to join the party of LTE 4G modul. Intel XMM 7160 is the first we heard, its designed for smartphones, tablets and PCs for sure. Intel XMM 7160 will compatible with LTE, DC-HSPA+ and EDGE standard. Atom Z25xx is their new device on x86-based processor (code-named: Clover Trail+). Meanwhile, ASUS and Lenovo ready to build smartphone and tablet based on its 32nm platform for dual-core CPUs include 1.2GHz Atom Z2520, 1.6GHz Atom Z2560, and 2GHz Atom Z2580.


(GOBY) Qualcomm LTE Modem - With 50% share on processor market worldwide, 86% is on LTE thas supports up to 40 different frequency for 4G LTE network. RF360 - Global-network support LTE chip-set for currently cellular netwrok available, include LTE-FDD, LTE-TDD, WCDMA, EV-DO,CDMA 1x, TD-SCDMA and GSM/EDGE. RF360 designed to reduce power consuption up to 50% compared to its predecessor. Expected to last longer battery life of LTE 4G smartphone.
* LTE modem module (Goby) by Qualcomm MDM9x25 (MDM9x15 successor) - The third gen of multimode 28nm LTE chip, 20 MHz FDD-LTE, LTE class 4, 150Mbps data speed, supports also 3GPP Release 10 for WCDMA band, DC-HSPA+ 50Mbps

Sequans LTE Modem - “combination of any two carriers of any size up to 20 megahertz each, contiguous or non-contiguous, inter-band or intra-band, for an overall total of 40 megahertz of bandwidth.” CEO Georges Karam. “This could take [download speeds] up to 300 Mbps, while today the max is 150 Mbps.” CEO Adds. Extected to be ready in 2014.

ST-Ericsson - NovaThor LTE series